Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device

ABSTRACT

Inner leads having die pads having upper surfaces to which semiconductor elements are mounted each have a stepped profile, and surfaces of portions of the inner leads are exposed from a sealing resin in plan view. Outer leads connected to the inner leads have first bends at side surfaces of the sealing resin to extend in a direction on a side of the upper surfaces of the die pads, so that a miniaturized semiconductor device can be obtained.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to a semiconductor device having power semiconductor elements mounted thereto, a semiconductor device manufacturing method, and a power converter.

Description of the Background Art

In a conventional semiconductor device, a lead protrudes from a side surface of a sealed resin portion, and is bent by bending at a substantially right angle at a bent portion near the resin portion (see Japanese Patent Application Laid-Open No. S62-229865 (the 5th line in the lower right column on page 2 to the 6th line in the upper left column on page 3, and FIGS. 1 to 5), for example).

Miniaturization of semiconductor devices has been required in recent years as a semiconductor device is implemented on a control substrate together with a variety of electronic components. The semiconductor device is miniaturized by causing a raised portion of a lead terminal to protrude downward from a lower surface of a sealing resin (see Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11), for example).

In such a semiconductor device, however, it is required to newly prepare a mold having a slit allowing for insertion of a lead in a sealing step of performing transfer molding, although the semiconductor device can be miniaturized by causing the lead to protrude vertically from a sealing resin of the semiconductor device. Furthermore, it is required to prepare a mold for each of semiconductor devices as the location where the lead is disposed varies with a specification of the semiconductor device.

SUMMARY

The present disclosure has been conceived to solve a problem as described above, and it is an object of the present disclosure to provide a semiconductor device and a semiconductor device manufacturing method allowing for miniaturization due to the shape of a lead.

A semiconductor device according to the present disclosure includes a semiconductor element, an inner lead, a sealing resin, and an outer lead. The inner lead has a die pad having an upper surface to which the semiconductor element is mounted. The sealing resin seals the semiconductor element and the inner lead. The outer lead is electrically connected to the semiconductor element and the inner lead, and protrudes from opposing side surfaces of the sealing resin. The inner lead has a stepped profile. A surface of a portion of the inner lead is exposed from the sealing resin in plan view. The outer lead has a first bend at each of the side surfaces of the sealing resin to extend in a direction on a side of the upper surface of the die pad.

A semiconductor device manufacturing method according to the present disclosure includes a member preparation step of preparing a lead frame including an inner lead having a die pad, a tie bar, a framework, and an outer lead, and having a stepped profile; a die bonding step of mounting a semiconductor element to the die pad; a wiring step of wiring the semiconductor element and the inner lead using a metal wire; a sealing step of sealing the semiconductor element, the metal wire, and the inner lead with a sealing resin so that the inner lead has an exposed surface that is a surface of a portion of the inner lead and exposed in plan view; a tie bar cutting step of cutting and removing the tie bar; a plating step of plating the outer lead, the exposed surface of the inner lead exposed from the sealing resin, and the framework; a frame cutting step of cutting and removing the framework; and a lead forming step of bending the outer lead at opposing side surfaces of the sealing resin.

According to the present disclosure, an easily miniaturized semiconductor device can be obtained, and the layout area of the semiconductor device implemented on a control substrate is reduced by the bent shape of the outer lead.

According to the semiconductor device manufacturing method according to the present disclosure, the easily miniaturized semiconductor device can be obtained, and the layout area of the semiconductor device implemented on the control substrate is reduced by the bent shape of the outer lead.

These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a semiconductor device according to Embodiment 1;

FIG. 2 is a cross-sectional view of the semiconductor device according to Embodiment 1;

FIG. 3 is a flowchart showing a semiconductor device manufacturing method according to Embodiment 1;

FIG. 4 is a plan view showing a state after a member preparation step of preparing a lead frame of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 5 is a cross-sectional view showing the state after the member preparation step of preparing the lead frame of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 6 is a plan view showing a state after a die bonding step of mounting semiconductor elements of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 7 is a plan view showing a state after a wiring step of performing wiring using metal wires of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 8 is a cross-sectional view showing the state after the wiring step of performing wiring using the metal wires of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 9 is a cross-sectional view showing a sealing step of performing sealing with a resin of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 10 is a plan view showing a state after the sealing step of performing sealing with the resin of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 11 is a cross-sectional view showing the state after the sealing step of performing sealing with the resin of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 12 is a plan view showing a state after a tie bar cutting step of cutting tie bars of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 13 is a plan view showing a state after a frame cutting step of cutting a framework of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 14 is a cross-sectional view showing a state of a lead forming step of bending outer leads of the semiconductor device manufacturing method according to Embodiment 1;

FIG. 15 is a cross-sectional view of a semiconductor device including RC-IGBTs as the semiconductor elements according to Embodiment 1;

FIG. 16 is a cross-sectional view of a semiconductor device including a thermally conductive material according to Embodiment 1;

FIG. 17 is a plan view of a semiconductor device according to Embodiment 2;

FIG. 18 is a cross-sectional view of the semiconductor device according to Embodiment 2;

FIG. 19 is a plan view of a modification of the semiconductor device according to Embodiment 2;

FIG. 20 is a cross-sectional view of the modification of the semiconductor device according to Embodiment 2;

FIG. 21 is a cross-sectional view of a semiconductor device according to Embodiment 3;

FIG. 22 is a plan view showing a state after the member preparation step of preparing the lead frame in a semiconductor device manufacturing method according to Embodiment 3;

FIG. 23 is a cross-sectional view showing a state after the sealing step of performing sealing with the resin of the semiconductor device manufacturing method according to Embodiment 3; and

FIG. 24 is a block diagram showing a configuration of a power conversion system including a power converter according to Embodiment 4.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1

A configuration of a semiconductor device according to Embodiment 1 will be described. FIG. 1 is a plan view of the semiconductor device according to Embodiment 1, and FIG. 2 is a cross-sectional view along the line A-A of FIG. 1 .

As shown in FIGS. 1 and 2 , the semiconductor device 202 includes semiconductor elements 1 a, semiconductor elements 1 b, joining materials 2, inner leads 3 e having die pads 3 a, outer leads 3 f, metal wires 4 a, metal wires 4 b, a sealing resin 5, and an insulating heat dissipation plate 6.

The semiconductor elements 1 a are power semiconductor elements. The semiconductor elements 1 a are, for example, insulated gate bipolar transistors (IGBTs), metal oxide semiconductor field effect transistors (MOSFETs), and freewheeling diodes (FWDs) formed of silicon (Si). One side of each of the semiconductor elements 1 a has a length of 3 mm to 13 mm in plan view.

The semiconductor elements 1 a are mounted to upper surfaces of the die pads 3 a through the joining materials 2. Two semiconductor elements 1 a are mounted to an upper surface of a die pad 3 a through joining materials 2 in FIG. 2 , but the number of semiconductor elements 1 a is not limited to two, and the required number of semiconductor elements 1 a can be mounted in accordance with a specification of the semiconductor device 202.

The upper surfaces of the die pads 3 a refer to surfaces to which the semiconductor elements 1 a are mounted. For example, a direction on a side of the upper surfaces of the die pads 3 a indicates an upward direction on the page of FIG. 2 .

The semiconductor elements 1 b are control integrated circuits (ICs) to control the semiconductor elements 1 a. The semiconductor elements 1 b are mounted to upper surfaces of die pads 3 b through the joining materials 2.

The upper surfaces of the die pads 3 b refer to surfaces to which the semiconductor elements 1 b are mounted. For example, a direction on a side of the upper surfaces of the die pads 3 b indicates an upward direction on the page of FIG. 2 .

The joining materials 2 join lower surfaces of the semiconductor elements 1 a and the upper surfaces of the die pads 3 a, and join lower surfaces of the semiconductor elements 1 b and the upper surfaces of the die pads 3 b. The joining materials 2 are solder materials including tin (Sn).

The joining materials 2 may be sintered materials including silver (Ag) or copper (Cu) or adhesives capable of dissipating heat generated by the semiconductor elements 1 a. Use of the sintered materials as the joining materials 2 allows the joining materials 2 to have high reliability and long lives as they have excellent heat resistance, and can suppress development of cracking against thermal stress and thermal strain generated due to coefficients of linear thermal expansion of the semiconductor elements 1 a and the die pads 3 a.

The inner leads 3 e having the die pads 3 a and the die pads 3 b, tie bars 3 c, a framework 3 d, and the outer leads 3 f are integrally connected to one another as a single lead frame 3 as shown in FIG. 4 . Thus, the inner leads 3 e having the die pads 3 a and the die pads 3 b, the tie bars 3 c, the framework 3 d, and the outer leads 3 f are formed of the same material, and have the same thickness.

A material for the inner leads 3 e having the die pads 3 a and the die pads 3 b, the tie bars 3 c, the framework 3 d, and the outer leads 3 f includes copper (Cu), but is not limited to the material including copper, and may be any material having required conductivity and heat dissipation. The material may be an alloy including copper (Cu) or aluminum (Al), or a layered composite material, for example.

The lead frame 3 including the inner leads 3 e having the die pads 3 a and the die pads 3 b, the tie bars 3 c, the framework 3 d, and the outer leads 3 f has a thickness of 0.3 mm to 0.8 mm.

The upper surfaces of the die pads 3 a and the die pads 3 b may be silver (Ag) plated to improve joining to the joining materials 2. Silver plating may be replaced with gold (Au) plating or tin (Sn) plating. The above-mentioned plating has a thickness of 0.001 mm to 0.002 mm.

At least portion of the inner leads 3 e may have microscopic surface irregularities to improve adhesion to the sealing resin 5. Priming can improve adhesion of the inner leads 3 e to the sealing resin 5 to thereby secure insulation.

The inner leads 3 e are located within the sealing resin 5, and each have a stepped profile. The inner leads 3 e have the die pads 3 a as mounts for the semiconductor elements 1 a and the die pads 3 b as mounts for the semiconductor elements 1 b.

On the page of FIG. 2 , the die pads 3 a and the die pads 3 b are located at the same step level, but the locations of the die pads 3 a and the die pads 3 b are not limited to these locations. That is to say, the die pads 3 a and the die pads 3 b may be located at different step levels. As shown in FIGS. 1 and 2 , surfaces of portions of the inner leads 3 e are exposed from an upper surface (on an upper side on the page of FIG. 2 ) of the sealing resin 5 in plan view.

The outer leads 3 f are electrically and structurally connected to the inner leads 3 e. The outer leads 3 f protrude from opposing side surfaces of the sealing resin 5. The outer leads 3 f have first bends 3 g at the side surfaces of the sealing resin 5 to thereby extend along the side surfaces of the sealing resin 5 in the direction on the side of the upper surfaces of the die pads 3 a.

That is to say, the outer leads 3 f are connected to the inner leads 3 e, and, as shown in FIG. 2 , protrude from the opposing side surfaces of the sealing resin 5, are bent at the side surfaces of the sealing resin 5, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

The metal wires 4 a and the metal wires 4 b are metals including any of aluminum (Al), copper (Cu), silver (Ag), and gold (Au). The metal wires 4 a and the metal wires 4 b are joined by pressurization and ultrasonic vibration, and electrically wire the semiconductor elements 1 a, the semiconductor elements 1 b, and the inner leads 3 e.

Materials for the metal wires 4 a and the metal wires 4 b, diameters of the metal wires 4 a and the metal wires 4 b, and the number of metal wires 4 a and metal wires 4 b correspond to required current-carrying capacities. For example, the metal wires 4 a are required to have large current-carrying capacities, and thus each have a diameter of 0.1 mm to 0.5 mm. On the other hand, since the semiconductor elements 1 b are the control ICs, the metal wires 4 b have small current-carrying capacities, and joining areas for wiring using the metal wires 4 b are small. The metal wires 4 b thus each have a diameter of 0.02 mm to 0.08 mm.

The sealing resin 5 includes an epoxy resin having thermosetting properties, but the sealing resin 5 is not limited to the epoxy resin, and may be any thermosetting resin having a desired elastic modulus and desired adhesion. Sealing with the sealing resin 5 is performed by transfer molding.

The insulating heat dissipation plate 6 is a plate having insulation and heat dissipation. The insulating heat dissipation plate 6 adheres to lower surfaces of the die pads 3 a, that is, surfaces of the die pads 3 a opposite the surfaces on which the joining materials 2 are located, and dissipate heat generated by the semiconductor elements 1 a through the die pads 3 a.

The insulating heat dissipation plate 6 has a double layer structure of an insulating layer 6 a and a metal layer 6 b, and a lower surface of the metal layer 6 b, that is, a surface of the metal layer 6 b opposite the surface on which the insulating layer 6 a is located is exposed from the sealing resin 5. The insulating heat dissipation plate 6 has a thermal conductivity of 2 W/(m·K) to 18 W/(m·K) and a thickness of 0.1 mm to 0.2 mm. The insulating layer 6 a includes an epoxy resin including any of alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), silicon dioxide (SiO₂), and boron nitride (BN), and filled with a filler, for example.

The metal layer 6 b includes a metal including copper (Cu) or aluminum (Al), and having excellent thermal conductivity.

When an operating temperature of the semiconductor elements 1 a exceeds a rated value due to usage conditions of the semiconductor device 202, performance of the semiconductor elements 1 a is reduced, and, at worst, thermal runaway occurs to break the semiconductor elements 1 a. The insulating heat dissipation plate 6 is thus required to have high heat dissipation in some cases, and heat dissipation can be improved by causing the metal layer 6 b to have a thickness of 1 mm to 3 mm.

Although not illustrated, a cooler can be attached, through thermal grease, to a lower surface of the insulating heat dissipation plate 6, that is, a surface of the insulating heat dissipation plate 6 opposite the surface on which the die pads 3 a are located. A material for the cooler is a metal including aluminum (Al) and having excellent thermal conductivity, and the cooler includes a plurality of fins.

According to the forgoing, in the semiconductor device 202, the semiconductor elements 1 a are mounted to the upper surfaces of the die pads 3 a through the joining materials 2, and the semiconductor elements 1 b are mounted to the upper surfaces of the die pads 3 b through the joining materials 2. The metal wires 4 a and the metal wires 4 b electrically wire the semiconductor elements 1 a, the semiconductor elements 1 b, and the inner leads 3 e. The insulating heat dissipation plate 6 adheres to the lower surfaces of the die pads 3 a, and dissipates heat generated by the semiconductor elements 1 a.

While the semiconductor elements 1 a, the semiconductor elements 1 b, the die pads 3 a, the die pads 3 b, and the inner leads 3 e are sealed with the sealing resin 5, the portions of the inner leads 3 e are exposed from the sealing resin 5.

That is to say, as shown in FIG. 2 , the surfaces of the portions of the inner leads 3 e located on a left side and a right side on the page of FIG. 2 are exposed, from the upper surface of the sealing resin 5, parallel to the upper surface of the sealing resin 5. The outer leads 3 f connected to the inner leads 3 e protrude from the opposing side surfaces of the sealing resin 5, have the first bends 3 g at the side surfaces of the sealing resin 5, are bent at substantially right angles, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

One side of the semiconductor device 202 has a length of 15 mm to 130 mm in plan view.

It is required to fix the semiconductor device 202 to bend the outer leads 3 f using a lead forming die (not illustrated). Bending using the lead forming die (not illustrated) is typically performed while portions of the outer leads 3 f near the locations where the outer leads 3 f protrude from the side surfaces of the sealing resin 5 are fixed by a clamping fixture (not illustrated). The first bends 3 g thus cannot be provided at the side surfaces of the sealing resin 5.

Fixing the sealing resin 5 is the only way to provide the first bends 3 g at the side surfaces of the sealing resin 5. If bending using the lead forming die (not illustrated) is performed while the sealing resin 5 is fixed, however, large stress can be applied to the sealing resin 5 to cause cracking of the sealing resin 5 as the sealing resin 5 is formed of a resin.

In the semiconductor device 202, however, the surfaces of the portions of the inner leads 3 e connected to the outer leads 3 f are exposed from the sealing resin 5 as described above.

Thus, when the outer leads 3 f are bent using the lead forming die (not illustrated), a fixture 10 can be brought into contact with and fixed to the portions of the inner leads 3 e exposed from the sealing resin 5 as shown in FIG. 14 , so that the outer leads 3 f can be bent at the side surfaces of the sealing resin 5.

Thus, the first bends 3 g can be provided at the side surfaces of the sealing resin 5 without causing cracking of the sealing resin 5, and the outer leads 3 f can be bent to extend in the direction on the side of the upper surfaces of the die pads 3 a.

Furthermore, as shown in FIG. 2 , the first bends 3 g are provided at the side surfaces of the sealing resin 5, and a distance L1 between the outer leads 3 f extending from the opposing side surfaces of the sealing resin 5 can be reduced.

As described above, the surfaces of the portions of the inner leads 3 e are exposed from the sealing resin 5, and the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5, and have the first bends 3 g to extend, so that the distance L1 between the outer leads 3 f can be reduced. The semiconductor device 202 including the outer leads 3 f can thereby be miniaturized. The layout area for implementation of the semiconductor device 202 on a control substrate can be reduced.

Furthermore, the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5, so that there is no need to newly prepare a mold 7 having a slit as disclosed in Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11) in a sealing step. Sealing can be performed using the conventional mold 7 having been used so far, so that frequency of replacement of the mold 7 with the new mold 7 and an increase in burden of maintenance of the mold 7 can be suppressed, and thus the semiconductor device 202 can be obtained with high productivity.

A semiconductor device manufacturing method will be described next.

FIG. 3 is a flowchart relating to the semiconductor device manufacturing method.

A member preparation step (S1) of the semiconductor device manufacturing method will be described. FIG. 4 is a plan view showing a state after the member preparation step of preparing the lead frame, and FIG. 5 is a cross-sectional view along the line B-B of FIG. 4 .

As shown in FIGS. 4 and 5 , the single lead frame 3 including the inner leads 3 e having the die pads 3 a and the die pads 3 b, the tie bars 3 c, the framework 3 d, and the outer leads 3 f is prepared (S1).

The tie bars 3 c connect the outer leads 3 f in a direction orthogonal to the outer leads 3 f. The framework 3 d is a peripheral portion of the lead frame 3, and connects the outer leads 3 f and the tie bars 3 c. As shown in FIG. 5 , the inner leads 3 e each have a stepped profile. The stepped profile of each of the inner leads 3 e is formed by pressing.

The lead frame 3 shown in FIG. 4 is that for a single semiconductor device 202, but the lead frame 3 can include a plurality of semiconductor devices 202. The plurality of semiconductor devices 202 can be obtained by collective and simultaneous sealing in a sealing step (S4) described below, allowing for high productivity.

A die bonding step (S2) of the semiconductor device manufacturing method will be described. FIG. 6 is a plan view showing a state after the die bonding step of mounting the semiconductor elements 1 a and the semiconductor elements 1 b.

The semiconductor elements 1 a are mounted to the upper surfaces of the die pads 3 a through the joining materials 2. Similarly, the semiconductor elements 1 b are mounted to the upper surfaces of the die pads 3 b through the joining materials 2. The joining materials 2 may be pastes or sheets. The semiconductor elements 1 a and the semiconductor elements 1 b can collectively and simultaneously be joined by reflow.

A wiring step (S3) of the semiconductor device manufacturing method will be described. FIG. 7 is a plan view showing a state after the wiring step of performing wiring using the metal wires 4 a and the metal wires 4 b, and FIG. 8 is a cross-sectional view along the line C-C of FIG. 7 .

The metal wires 4 a wire the semiconductor elements 1 a and the inner leads 3 e, and the metal wires 4 b wire the semiconductor elements 1 b, the semiconductor elements 1 a, and the inner leads 3 e. In a wiring method, an ultrasonic tool (not illustrated) applies ultrasonic vibration while performing pressurization to ultrasonically join the metal wires 4 a and the metal wires 4 b.

The number of directions of ultrasonic vibration may be one or two. Ultrasonic joining is performed while the lead frame 3 is heated under an inert atmosphere including nitrogen (N₂) as necessary to obtain wiring having a high joining strength and high reliability.

The sealing step (S4) of the semiconductor device manufacturing method will be described. FIG. 9 is a cross-sectional view showing the sealing step (S4) of performing sealing with a resin.

A sealing method is transfer molding performed using a mold. The mold 7 includes a pair of an upper mold 7 a and a lower mold 7 b, and heaters (not illustrated) are embedded in the upper mold 7 a and the lower mold 7 b. The heaters (not illustrated) raise the temperatures of the upper mold 7 a and the lower mold 7 b. The lead frame 3 and the insulating heat dissipation plate 6 having completed the wiring step (S3) are placed in an internal space of the mold 7 including the upper mold 7 a and the lower mold 7 b, and a thermosetting resin is injected into the internal space of the mold 7 through a gate (not illustrated) as a resin inlet provided between the upper mold 7 a and the lower mold 7 b.

The sealing step (S4) is completed by performing post-curing due to heating after injection of the resin to completely cure the sealing resin 5.

FIG. 10 is a plan view showing a state after the sealing step of performing sealing with the resin, and FIG. 11 is a cross-sectional view along the line D-D of FIG. 10 . The inner leads 3 e are sealed with the thermosetting resin, and are located within the sealing resin 5, but, as shown in FIGS. 10 and 11 , the surfaces of the portions of the inner leads 3 e are sealed to be exposed from the upper surface of the sealing resin 5 in plan view.

In the sealing step (S4), the insulating heat dissipation plate 6 is transfer molded, and can adhere to the lower surfaces of the die pads 3 a due to heating from the mold 7 having the raised temperature, allowing for extremely high productivity.

A tie bar cutting step (S5) and a plating step (S6) of the semiconductor device manufacturing method will be described. FIG. 12 is a plan view showing a state after the tie bar cutting step of cutting the tie bars.

The tie bars 3 c are cut and removed by shearing using a tie bar cutting die (not illustrated). The outer leads 3 f, the surfaces of the portions of the inner leads 3 e exposed from the sealing resin 5, and the framework 3 d are then plated in the plating step (S6). A plating material is tin (Sn) or an alloy including tin (Sn).

A frame cutting step (S7) of the semiconductor device manufacturing method will be described. FIG. 13 is a plan view showing a state after the frame cutting step of cutting the framework 3 d. The framework 3 d is cut and removed by shearing using a frame cutting die (not illustrated).

A lead forming step (S8) of the semiconductor device manufacturing method will be described. FIG. 14 is a cross-sectional view showing a state of the lead forming step (S8) of bending the outer leads 3 f.

The fixture 10 is brought into contact with and fixed to the portions of the inner leads 3 e connected to the outer leads 3 f and exposed from the sealing resin 5. The outer leads 3 f are subjected to a load in a direction of arrows W shown in FIG. 14 by the lead forming die (not illustrated). The first bends 3 g are thereby provided at the side surfaces of the sealing resin 5, and the outer leads 3 f protruding from the side surfaces of the sealing resin 5 are bent and extend in the direction on the side of the upper surfaces of the die pads 3 a along the side surfaces of the sealing resin 5.

As a result, the outer leads 3 f can be bent at substantially right angles at the first bends 3 g provided at the side surfaces of the sealing resin 5 without causing cracking of the sealing resin 5.

The outer leads 3 f may be bent by roller bending or cam bending.

Even if the locations where the outer leads 3 f are arranged vary with a specification of the semiconductor device 202, sealing can be performed using the same mold 7 as only arrangement and the shapes of the inner leads 3 e and the outer leads 3 f vary. The lead forming die (not illustrated) can easily be adjusted, so that the outer leads 3 f can be bent to have the first bends 3 g at the side surfaces of the sealing resin 5 to extend in the direction on the side of the upper surfaces of the die pads 3 a.

As described above, according to the semiconductor device manufacturing method, the surfaces of the portions of the inner leads 3 e are exposed from the sealing resin 5, and the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5, and have the first bends 3 g to extend, so that the distance L1 between the outer leads 3 f can be reduced. The semiconductor device 202 including the outer leads 3 f can thereby be miniaturized. The layout area for implementation of the semiconductor device 202 on the control substrate can be reduced.

Furthermore, the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5, so that there is no need to newly prepare the mold 7 having the slit as disclosed in Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11) in the sealing step (S4). Sealing can be performed using the conventional mold 7 having been used so far, so that the frequency of replacement of the mold 7 with the new mold 7 and the increase in burden of maintenance of the mold 7 can be suppressed, and thus the semiconductor device manufacturing method allows for high productivity.

In Embodiment 1, the semiconductor elements 1 a are mounted to the upper surfaces of the die pads 3 a through the joining materials 2, and the semiconductor elements 1 b are mounted to the upper surfaces of the die pads 3 b through the joining materials 2. The metal wires 4 a and the metal wires 4 b electrically wire the semiconductor elements 1 a, the semiconductor elements 1 b, and the inner leads 3 e. The insulating heat dissipation plate 6 adheres to the lower surfaces of the die pads 3 a, and dissipates heat generated by the semiconductor elements 1 a.

The semiconductor elements 1 a, the semiconductor elements 1 b, the die pads 3 a, the die pads 3 b, and the inner leads 3 e are sealed with the sealing resin 5, but the surfaces of the portions of the inner leads 3 e are exposed from the sealing resin 5.

The outer leads 3 f connected to the inner leads 3 e protrude from the opposing side surfaces of the sealing resin 5, have the first bends 3 g at the side surfaces of the sealing resin 5, are bent at substantially right angles, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

With a configuration as described above, the semiconductor device 202 as easily miniaturized can be obtained. Furthermore, the layout area of the semiconductor device 202 implemented on the control substrate can be reduced.

The semiconductor device 202 can be 8% to 20% smaller than a semiconductor device as disclosed in Japanese Patent Application Laid-Open No. S62-229865 (the 5th line in the lower right column on page 2 to the 6th line in the upper left column on page 3, and FIGS. 1 to 5).

There is no need to newly prepare the mold 7 having the slit as disclosed in Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11), and sealing can be performed using the conventional mold 7 having been used so far, allowing for high productivity.

The portions of the inner leads 3 e are exposed from the upper surface of the sealing resin 5 in plan view, and the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5 as shown in FIG. 2 , so that a sufficient insulating distance can be secured as a distance L2 from an interface between the metal layer 6 b of the insulating heat dissipation plate 6 and the cooler (not illustrated) attached to the insulating heat dissipation plate 6 to the first bends 3 g.

Furthermore, each of the semiconductor elements 1 a may be a reverse conducting insulated gate bipolar transistor (an RC-IGBT) including an IGBT and a freewheeling diode formed as a single piece. FIG. 15 is a cross-sectional view of a semiconductor device 202 a including RC-IGBTs as the semiconductor elements 1 a.

Since a pair of the IGBT and the FWD can be replaced with a single RC-IGBT, the area of the die pads 3 a required to mount the semiconductor elements 1 a can significantly be reduced. The size of the sealing resin 5 is thus reduced, so that the semiconductor device 202 a can be miniaturized. The layout area of the semiconductor device 202 a implemented on the control substrate can be reduced.

The semiconductor elements 1 a may each include a so-called wide bandgap semiconductor formed of a material such as silicon carbide (SiC), gallium nitride (GaN), and diamond, and having a wider bandgap than silicon (Si).

Use of the elements each including the wide bandgap semiconductor allows for reduction in size of the semiconductor elements 1 a as they can reduce power loss and perform high temperature operation compared with those including silicon (Si). That is to say, the area of the die pads 3 a can be reduced to thereby reduce the size of the sealing resin 5, so that the semiconductor device 202 can be miniaturized. The layout area of the semiconductor device 202 implemented on the control substrate can be reduced.

A thermally conductive material 8 may be provided on a lower side of the insulating heat dissipation plate 6, that is, the surface of the insulating heat dissipation plate 6 opposite the surface on which the die pads 3 a are located. FIG. 16 is a cross-sectional view of a semiconductor device 202 b including the thermally conductive material 8.

The thermally conductive material 8 is a plate-like thermal interface material (TIM). The thermally conductive material 8 allows the insulating heat dissipation plate 6 to efficiently dissipate heat generated by the semiconductor elements 1 a to the cooler (not illustrated) attached to the insulating heat dissipation plate 6. The thermally conductive material 8 may be a graphite sheet, for example. Since the semiconductor device 202 b involves a wide temperature change due to the semiconductor elements 1 a, typical thermal grease can cause degradation due to pump-out, and increase thermal resistance.

The TIM, however, softens and undergoes a phase change with temperature, and thus can respond to the wide temperature change of the semiconductor device 202 b, and maintain stable thermal resistance. The semiconductor device 202 b can thereby maintain desired electrical properties.

The thermally conductive material 8 has a thickness of 0.03 mm to 0.2 mm. The thermally conductive material 8 can have high thermal conductivity by mixing therein a metal filler.

For convenience in production, the thermally conductive material 8 may be provided not only on the lower side of the insulating heat dissipation plate 6 but also on the entire surface to be in contact with the cooler (not illustrated) including a lower surface of the sealing resin 5 as shown in FIG. 16 .

The semiconductor device 202 b can be miniaturized by addressing concern about an increase in thermal resistance and securing sufficient heat dissipation at an interface between the semiconductor device 202 b and the cooler (not illustrated). The layout area of the semiconductor device 202 b implemented on the control substrate can be reduced.

Embodiment 2

FIG. 17 is a plan view of a semiconductor device 202 c according to Embodiment 2, and FIG. 18 is a cross-sectional view along the line E-E of FIG. 17 . The semiconductor device and a semiconductor device manufacturing method in the present embodiment have many components in common with those in Embodiment 1. Thus, only the difference from the semiconductor device and the semiconductor device manufacturing method in Embodiment 1 will be described, and the same or corresponding components bear the same reference sign, and description thereof will be omitted. The difference from Embodiment 1 is a configuration in which the outer leads 3 f have second bends 3 h in addition to the first bends 3 g, and are arranged parallel to exposed surfaces of the inner leads 3 e exposed from the sealing resin 5 as shown in FIGS. 17 and 18 .

As shown in FIGS. 17 and 18 , the inner leads 3 e have the exposed surfaces being the surfaces of the portions of the inner leads 3 e exposed from the upper surface of the sealing resin 5. The outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5. The outer leads 3 f have the first bends 3 g at the side surfaces of the sealing resin 5 to be arranged parallel to the exposed surfaces of the inner leads 3 e. Furthermore, the outer leads 3 f arranged parallel to the exposed surfaces of the inner leads 3 e have the second bends 3 h to extend in the direction on the side of the upper surfaces of the die pads 3 a.

A plurality of portions of each of the outer leads 3 f are bent. The second bends 3 h are provided using a lead forming die (not illustrated) in the lead forming step of bending the outer leads 3 f. The first bends 3 g are then provided using the lead forming die (not illustrated) at the side surfaces of the sealing resin 5 so that the outer leads 3 f are arranged parallel to the exposed surfaces of the inner leads 3 e.

As described above, the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5, have the first bends 3 g at the side surfaces of the sealing resin 5, are arranged parallel to the exposed surfaces of the inner leads 3 e exposed from the sealing resin 5, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

A distance L3 between the outer leads 3 f extending in the direction on the side of the upper surfaces of the die pads 3 a can thus be shorter than the distance L1 in Embodiment 1.

In Embodiment 2, the outer leads 3 f connected to the inner leads 3 e protrude from the opposing side surfaces of the sealing resin 5, have the first bends 3 g at the side surfaces of the sealing resin 5, and are arranged parallel to the exposed surfaces being the surfaces of the portions of the inner lead 3 e exposed from the upper surface of the sealing resin 5. Furthermore, the outer leads 3 f arranged parallel to the exposed surfaces of the inner leads 3 e have the second bends 3 h, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

With a configuration as described above, the semiconductor device 202 c as easily miniaturized can be obtained. Furthermore, the layout area of the semiconductor device 202 c implemented on the control substrate can be reduced.

There is no need to newly prepare the mold 7 having the slit as disclosed in Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11), and sealing can be performed using the conventional mold 7 having been used so far, allowing for high productivity.

The inner leads 3 e have the exposed surfaces being the surfaces of the portions of the inner leads 3 e exposed from the upper surface of the sealing resin 5 in plan view, and the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5 as shown in FIG. 18 , so that a sufficient insulating distance can be secured as the distance L2 from the interface between the metal layer 6 b of the insulating heat dissipation plate 6 and the cooler (not illustrated) attached to the insulating heat dissipation plate 6 to the first bends 3 g.

As shown in FIGS. 19 and 20 , the outer leads 3 f may not have the second bends 3 h. FIG. 19 is a plan view of a semiconductor device 202 d in which the second bends 3 h are not provided, and FIG. 20 is a cross-sectional view along the line F-F of FIG. 19 .

The outer leads 3 f can be surface implemented on the control substrate without being inserted into through holes of the control substrate. This improves heat dissipation from the outer leads 3 f to the control substrate, and allows a high current to flow.

Embodiment 3

FIG. 21 is a cross-sectional view of a semiconductor device 202 e according to Embodiment 3. The semiconductor device and a semiconductor device manufacturing method in the present embodiment have many components in common with those in Embodiment 1. Thus, only the difference from the semiconductor device and the semiconductor device manufacturing method in Embodiment 1 will be described, and the same or corresponding components bear the same reference sign, and description thereof will be omitted. The difference from Embodiment 1 is a configuration in which the outer leads 3 f have grooves 9 at the first bends 3 g as shown in FIG. 21 .

FIG. 22 is a plan view showing a state after the member preparation step of preparing the lead frame 3 of the semiconductor device 202 e. As shown in FIG. 22 , the grooves 9 each having a depth of approximately 20% of the thickness of the lead frame 3 are provided by pressing in surfaces to be the first bends 3 g and to be subjected to compressive stress when being bent. The grooves 9 can easily be provided by pressing, allowing for high productivity.

FIG. 23 is a cross-sectional view showing a state after the sealing step of performing sealing of the semiconductor device 202 e with the resin. As shown in FIG. 23 , the grooves 9 are provided in the surfaces to be subjected to the compressive stress when being bent, so that the outer leads 3 f can easily be bent with accuracy in the lead forming step (S8), allowing for high productivity.

When the semiconductor device 202 e is implemented on the control substrate, misalignment of the outer leads 3 f can be suppressed by bending with accuracy, and the semiconductor device 202 e can easily be implemented.

Also in Embodiment 3, the outer leads 3 f connected to the inner leads 3 e protrude from the opposing side surfaces of the sealing resin 5, have, at the side surfaces of the sealing resin 5, the first bends 3 g having the grooves 9 in the surfaces to be subjected to the compressive stress when being bent, are bent at substantially right angles, and extend in the direction on the side of the upper surfaces of the die pads 3 a.

With a configuration as described above, the semiconductor device 202 e as easily miniaturized can be obtained. The layout area of the semiconductor device 202 e implemented on the control substrate can be reduced. Furthermore, the semiconductor device 202 e can easily be positioned and implemented on the control substrate.

There is no need to newly prepare the mold 7 having the slit as disclosed in Japanese Patent Application Laid-Open No. H10-223825 (paragraphs 0030, 0032 to 0033, 0036, and FIGS. 9 and 11), and sealing can be performed using the conventional mold 7 having been used so far, allowing for high productivity.

The inner leads 3 e have the exposed surfaces being the surfaces of the portions of the inner lead 3 e exposed from the upper surface of the sealing resin 5 in plan view, and the outer leads 3 f protrude from the opposing side surfaces of the sealing resin 5 as shown in FIG. 21 , so that a sufficient insulating distance can be secured as the distance L2 from the interface between the metal layer 6 b of the insulating heat dissipation plate 6 and the cooler (not illustrated) attached to the insulating heat dissipation plate 6 to the first bends 3 g.

Embodiment 4

The semiconductor device 202 according to Embodiment 1 described above is applied to a power converter in the present embodiment. The present invention is not limited to a particular power converter, but a case where the present invention is applied to a three-phase inverter will be described below in Embodiment 4.

FIG. 24 is a block diagram showing a configuration of a power conversion system to which the power converter according to Embodiment 4 has been applied.

The power conversion system shown in FIG. 24 includes a power supply 100, a power converter 200, and a load 300. The power supply 100 is a DC power supply, and supplies DC power to the power converter 200. The power supply 100 can be configured in various forms, and, for example, can be configured by a DC system, a solar cell, or a storage battery, and may be configured by a rectifier circuit or an AC/DC converter connected to an AC system. The power supply 100 may be configured by a DC/DC converter to convert DC power output from the DC system into predetermined power.

The power converter 200 is a three-phase inverter connected between the power supply 100 and the load 300, and converts the DC power supplied and input from the power supply 100 into AC power, and supplies the AC power to the load 300. As shown in FIG. 24 , the power converter 200 includes a main conversion circuit 201 to convert the DC power into the AC power for output and a control circuit 203 to output, to the main conversion circuit 201, a control signal to control the main conversion circuit 201.

The load 300 is a three-phase motor driven by the AC power supplied from the power converter 200. The load 300 is not limited to that for a particular application, is a motor mounted on various types of electrical equipment, and is used as a motor for hybrid vehicles, electric vehicles, railroad vehicles, elevators, and air-conditioning equipment, for example.

The power converter 200 will be described in detail below. The main conversion circuit 201 includes switching elements and freewheeling diodes (not illustrated), and converts the DC power supplied from the power supply 100 into the AC power, and supplies the AC power to the load 300 through switching of the switching elements. The main conversion circuit 201 can have various specific circuit configurations, and the main conversion circuit 201 according to the present embodiment is a two-level three-phase full-bridge circuit, and can include six switching elements and six freewheeling diodes connected in anti-parallel with the respective switching elements. The switching elements and the freewheeling diodes of the main conversion circuit 201 are each configured by the semiconductor device corresponding to that in any of Embodiments 1 to 3 described above. A case where the switching elements and the freewheeling diodes are each configured by the semiconductor device 202 according to Embodiment 1 will be described herein, Every two switching elements out of the six switching elements are connected in series with each other to constitute pairs of upper and lower arms, and the pairs of upper and lower arms constitute respective phases (a U phase, a V phase, and a W phase) of the full-bridge circuit. Output terminals of the respective pairs of upper and lower arms, that is, three output terminals of the main conversion circuit 201 are connected to the load 300.

The main conversion circuit 201 includes a drive circuit (not illustrated) to drive each of the switching elements, and the drive circuit may be incorporated in the semiconductor device 202, or may be provided separately from the semiconductor device 202. The drive circuit generates a drive signal to drive each of the switching elements of the main conversion circuit 201, and supplies the drive signal to a control electrode of each of the switching elements of the main conversion circuit 201. Specifically, the drive circuit outputs, to the control electrode of each of the switching elements, a drive signal to switch the switching element to an on state and a drive signal to switch the switching element to an off state in accordance with the control signal from the control circuit 203, which will be described below. The drive signal is a voltage signal (an on signal) equal to or greater than a threshold voltage of the switching element when the switching element is maintained in the on state, and is a voltage signal (an off signal) equal to or smaller than the threshold voltage of the switching element when the switching element is maintained in the off state.

The control circuit 203 controls the switching elements of the main conversion circuit 201 so that desired power is supplied to the load 300. Specifically, time (on time) during which each of the switching elements of the main conversion circuit 201 is to be in the on state is calculated based on power to be supplied to the load 300. For example, the main conversion circuit 201 can be controlled through PWM control to modulate the on time of each of the switching elements in accordance with a voltage to be output. A control command (the control signal) is output to the drive circuit of the main conversion circuit 201 so that the on signal is output to a switching element to be in the on state, and the off signal is output to a switching element to be in the off state at each time point. The drive circuit outputs, as the drive signal, the on signal or the off signal to the control electrode of each of the switching elements in accordance with the control signal.

In the power converter according to the present embodiment, the semiconductor device 202 according to Embodiment 1 is applied to each of the switching elements and the freewheeling diodes of the main conversion circuit 201 to improve reliability.

An example in which the present invention is applied to the two-level three-phase inverter has been described in the present embodiment, but the present invention is not limited to this example, and is applicable to various power converters. Although the power converter in the present embodiment is a two-level power converter, the power converter may be a three-level or multi-level power converter, and the present invention may be applied to a single-phase inverter when power is supplied to a single-phase load. The present invention is applicable to a DC/DC converter or an AC/DC converter when power is supplied to a DC load and the like.

The power converter to which the present disclosure has been applied is not limited to that in the above-mentioned case where the load is the motor, and can be used as a power supply device of an electrical discharge machine, a laser machine, an induction cooker, and a noncontact power supply system, for example, and can further be used as a power conditioner of a photovoltaic system, a storage system, and the like.

Embodiments of the present disclosure can freely be combined with each other, and can be modified or omitted as appropriate.

While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention. 

What is claimed is:
 1. A semiconductor device comprising: a semiconductor element; an inner lead having a die pad having an upper surface to which the semiconductor element is mounted; a sealing resin sealing the semiconductor element and the inner lead; and an outer lead electrically connected to the semiconductor element and the inner lead, and protruding from opposing side surfaces of the sealing resin, wherein the inner lead has a stepped profile, and a surface of a portion of the inner lead is exposed from an upper surface of the sealing resin in plan view, and the outer lead has a first bend at each of the side surfaces of the sealing resin to extend in a direction on a side of the upper surface of the die pad, wherein the inner leads and the outer leads are integrally connected to one another.
 2. The semiconductor device according to claim 1, wherein the outer lead has, at the first bend, a groove in a surface to be subjected to compressive stress by being bent.
 3. The semiconductor device according to claim 1, further comprising an insulating heat dissipation plate located on a lower surface of the die pad to which the semiconductor element is mounted, and exposed from the sealing resin.
 4. The semiconductor device according to claim 3, further comprising a plate-like thermally conductive material located on a surface of the insulating heat dissipation plate exposed from the sealing resin.
 5. The semiconductor device according to claim 1, wherein the semiconductor element is an RC-IGBT.
 6. The semiconductor device according to claim 1, wherein the semiconductor element comprises a wide bandgap semiconductor.
 7. A power converter comprising: a main conversion circuit to convert input power for output, the main conversion circuit including the semiconductor device according to claim 1; and a control circuit to output, to the main conversion circuit, a control signal to control the main conversion circuit.
 8. A semiconductor device comprising: a semiconductor element; an inner lead having a die pad having an upper surface to which the semiconductor element is mounted; a sealing resin sealing the semiconductor element and the inner lead; and an outer lead electrically connected to the semiconductor element and the inner lead, and protruding from opposing side surfaces of the sealing resin, wherein the inner lead has a stepped profile and an exposed surface that is a surface of a portion of the inner lead and exposed from an upper surface of the sealing resin in plan view, and the outer lead has a first bend at each of the side surfaces of the sealing resin, and is disposed parallel to the exposed surface of the inner lead exposed from the sealing resin, wherein the inner leads and the outer leads are integrally connected to one another.
 9. The semiconductor device according to claim 8, wherein the outer lead has a second bend to extend in a direction on a side of the upper surface of the die pad.
 10. The semiconductor device according to claim 8, wherein the outer lead has, at the first bend, a groove in a surface to be subjected to compressive stress by being bent.
 11. The semiconductor device according to claim 8, further comprising an insulating heat dissipation plate located on a lower surface of the die pad to which the semiconductor element is mounted, and exposed from the sealing resin.
 12. The semiconductor device according to claim 11, further comprising a plate-like thermally conductive material located on a surface of the insulating heat dissipation plate exposed from the sealing resin.
 13. The semiconductor device according to claim 8, wherein the semiconductor element is an RC-IGBT.
 14. The semiconductor device according to claim 8, wherein the semiconductor element comprises a wide bandgap semiconductor.
 15. A power converter comprising: a main conversion circuit to convert input power for output, the main conversion circuit including the semiconductor device according to claim 8; and a control circuit to output, to the main conversion circuit, a control signal to control the main conversion circuit.
 16. A semiconductor device manufacturing method comprising: a member preparation step of preparing a lead frame including an inner lead having a die pad, a tie bar, a framework, and an outer lead, the lead frame having a stepped profile; a die bonding step of mounting a semiconductor element to the die pad; a wiring step of wiring the semiconductor element and the inner lead using a metal wire; a sealing step of sealing the semiconductor element, the metal wire, and the inner lead with a sealing resin so that the inner lead has an exposed surface that is a surface of a portion of the inner lead and exposed an upper surface of the sealing resin in plan view; a tie bar cutting step of cutting and removing the tie bar; a plating step of plating the outer lead, the exposed surface of the inner lead exposed from the sealing resin, and the framework; a frame cutting step of cutting and removing the framework; and a lead forming step of bending the outer lead at opposing side surfaces of the sealing resin, wherein the inner leads and the outer leads are integrally connected to one another.
 17. The semiconductor device manufacturing method according to claim 16, wherein the lead forming step includes bending a plurality of portions of the outer lead.
 18. The semiconductor device manufacturing method according to claim 16, wherein the member preparation step includes preparing the lead frame including the outer lead having a groove. 